BT laminate sheet has been changed the history of chip packaging.MGC was
the first company in Japan to provide resin-based laminate materials
for printed circuit boards (PCBs). Laminated materials for PCBs are made
of multiple layers of impregnated and dried glass fiber cloth or other
base materials that are pressed onto the chip substrate. MGC invented a
revolutionary thermal-hardened bismaleimide triazine (BT) resin material
that is both low cost and provides excellent thermal and electrical
properties. Our BT resin laminate is playing a key role in the advances
in electronic equipment and information technology.To get more news
about BT PCB, you can visit pcbmake official website.
While the world’s elite athletes were vying for medals at the 1976
Montreal Olympics, MGC introduced its revolutionary BT resin that became
the gold standard for chip packaging. At the time, the laminated sheet
used for the PCBs of high-performance chips was mostly high-cost
ceramic. BT resin offered an alternative that exhibited thermal and
electrical properties on par with ceramic but at a lower cost. The chip
manufacturing industry took notice, and in 1985 BT resin became the
first resin laminate material used for chip packaging. Then in the 1990s
it rapidly gained acceptance in Japan and worldwide when the industry
recognized that in addition to the cost savings, BT resin also
simplified the chip fabrication process. BT resin is currently the
preeminent laminate material for chip packaging around the world.
Any device that has electronic components, from computers and household
electronics to automobiles and robots, has one or several built in
computer chips. The device makers are constantly seeking to make their
products more competitive by making them smaller and lighter while at
the same time making them more sophisticated to offer higher
performance. You may have a prime example of this in your
pocket—smartphone technology evolves with each new model, simultaneously
becoming lighter, more versatile, and more powerful.
The makers of the chips inside those devices are constantly seeking ways
to advance their chip technology to keep up with manufacturer demand
for greater device functionality. Making devices lighter while enhancing
performance requires packing more parts into the chip package. This is
being made possible by using denser materials that enable decreasing the
spacing between the traces on the substrates. Trace spacing has
narrowed from over 100 microns to less than 20 microns (1 micron is one
thousandth of a millimeter). The biggest challenge when producing PCBs
is preventing deformation or curvature caused by temperature change. PCB
manufacturing includes processes that alternate hot and cold, and the
chip must be made of materials that hold their shape in such conditions.
Chips also must be able to maintain their performance specifications
without degrading throughout their usage lifetime during the incessant
expansion and contraction that occurs each time a device turns on and
off. BT resin is a “low warp” material with high structural integrity
that performs exceptionally in all aspects. Our BT resin is a key
material in the chips that run today’s electronic devices, and we are
continuing to develop and advance our BT resin’s capabilities for the
technology of tomorrow.
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